CALL FOR PAPERS
IEEE Transactions on Multimedia
Special Issue on: Multimedia over IP
Multimedia -- an integrated and interactive presentation of speech, audio,
video, graphics, and text -- have become the major theme in today's
information technology that merges practices of communication, computing,
and information processing into an interdisciplinary field. Today's IP-based
data networks are absorbing those multimedia services at a rapid pace --
in Internet time -- and are enabling a whole new class of applications to
enhance productivity, reduce costs, and increase business agility.
Anticipating that the multimedia over IP will become emerging technologies
for the 21st century, this issue of TMM is devoted to address the challenge
of how to deliver multimedia applications over IP in a cost effective,
ubiquitous and quality guaranteed manner. The possible topics include,
but are not limited to, the following:
* Multimedia over IP systems and applications
* Design and implementation of multimedia over IP
* Multimedia over mobile IP
* Resource allocation and QoS for multimedia over IP
* Content-aware techniques for multimedia over IP
* IP network-adaptive multimedia communication
* Error resilience and control techniques over IP
* Watermarking and security for IP applications
* Multimedia coding for IP transmission
* Multimedia database over IP
Original, previously-unpublished research articles will be considered.
Authors should follow the IEEE TMM manuscript format described in the
Information for Authors, which can be found on the inside back cover
of any issue of TMM. Prospective authors are invited to submit papers to
the website: http://eivind.imm.dtu.dk/mmsptc.
The following schedule will apply:
Manuscript submission: May 31, 2000
Acceptance notification: October 31, 2000
Final manuscript due: November 30, 2000
Publication: March, 2001
Jie Chen Sadaoki Furui
Bell Labs Department of Computer Science
600 Mountain Avenue Tokyo Institute of Technology
Murray Hill, NJ 07974, USA 2-12-1, Ookayama, Meguro-ku
jchen10@lucent.com Tokyo, 152-8552 Japan
furui@cs.titech.ac.jp
Jenq-Neng Hwang K. J. Ray Liu
Department of Electrical Engineering Electrical Engineering
Department
Box 352500, University of Washington University of Maryland
Seattle, WA 98195, USA College Park, MD 20742, USA
hwang@ee.washington.edu kjrliu@eng.umd.edu
John Aasted Sorensen
Department of Mathematical Modelling
Technical University of Denmark
2800 Lyngby, Denmark
jaas@imm.dtu.dk