Machine Vision Applications in Industrial Inspection VIII (EI17) Post-Meeting Proceedings. Abstracts (500 words) for this conference are due by 28 June 1999. Manuscripts are due by 27 December 1999. Conference Chairs: Kenneth W. Tobin, Jr., Oak Ridge National Lab.; Ning S. Chang, KLA-Tencor Corp. Program Committee: Ariel Ben-Porath, Applied Materials (Israel); Steven P. Floeder, 3M Co.; Joon H. Han, Pohang Univ. of Science and Technology (Korea); Emerico Natonek, Andersen Consulting (Germany); A. R. Rao, IBM Thomas J. Watson Research Ctr.; Vijay Sankaran, SEMATECH Machine vision can be described as the bringing together of imaging devices, computers, algorithms, and robotics to automate manufacturing inspection, characterization, and control. Today's high-speed, complex manufacturing systems have required the development of automation technologies that can efficiently collect data, use historical information to provide context, and generate process knowledge. Intelligently designed systems can use this knowledge for automatic characterization and control of product quality and the manufacturing process. In this regard, machine vision technology continues to provide new and innovative opportunities to automate manufacturing systems. The semiconductor and electronic industries are excellent examples of the successful application of machine vision technology today. Almost all semiconductor and electronic manufacturing equipment include machine vision systems to perform essential tasks such as alignment and positioning, and information gathering tasks such as automatic defect and signature classification for yield management. Many other industries are witnessing a rapid adoption of this technology including aluminum, forest products, textiles, glass, steel, metal casting, and chemicals. There are numerous innovative methods for adding machine vision systems to manufacturing processes to improve productivity, quality, and compliance with product standards, thus providing a competitive advantage. This conference brings together practitioners and researchers in machine vision to share recent developments in computer vision architectures, hardware, algorithms, and software for industrial inspection, characterization, and control. Papers emphasizing the integration of machine vision systems into the manufacturing infrastructure are especially welcome. Papers are solicited in four broad topical areas: * image processing and metrology * measurement of color and appearance * feature analysis and pattern recognition * machine vision systems integration and process characterization. Individual papers are solicited but not limited to the following topics: * new or improved algorithms for industrial inspection * novel hardware designs for machine vision systems * robot vision and tracking * performance evaluation of algorithms * use of 3D or color imaging techniques * industrial applications of machine vision * food, agriculture, and pharmaceuticals applications of machine vision * machine learning, pattern recognition, and feature analysis techniques * use of machine vision information for process control and diagnosis, trend analysis, and preventive maintenance * case studies of the impact of machine vision in manufacturing. All submissions will be peer reviewed. Please note that abstracts must be at least 500 words in length in order to receive full consideration. IS&T/SPIE's Symposium on ELECTRONIC IMAGING 2000: Science and Technology Abstract (approx. 500 words) Due Date: 28 June 1999 Manuscript Due Date: 27 December 1999 Final Summary (200 words) Due Date: 22 November 1999 Instructions for Submitting Abstracts * All authors are STRONGLY ENCOURAGED to submit their abstracts by the due date using the Web form located at URL: www.spie.org/info/ei/ If World-Wide Web access is not available, please choose only one of the following options and send by the due date: * E-MAIL each abstract separately to: abstracts@spie.org in ASCII text (not encoded) format. IMPORTANT: to ensure receipt and proper processing of your abstract, the Subject line must include only the following: SUBJECT: EI17, TOBIN, CHANG * or MAIL three copies of your abstract to: IS&T/SPIE EI 2000, SPIE, P.O. Box 10, Bellingham, WA 98227-0010 USA Shipping Address: 1000 20th St., Bellingham, WA 98225 USA Telephone 360/676-3290 * or FAX one copy to SPIE at 360/647-1445 (send each abstract separately). Your abstract must include all of the following: 1. SUBMIT TO: EI17, TOBIN, CHANG 2. SUBMIT EACH ABSTRACT TO ONE CONFERENCE ONLY. Machine Vision Applications in Industrial Inspection VIII 3. ABSTRACT TITLE 4. AUTHOR LISTING (principal author first) First(given)name Last(family)name, Affiliation, Mailing address, telephone, fax, and email address. 5. PRESENTATION Indicate your preference for "Oral Presentation" or "Poster Presentation." Placement is subject to chairs' discretion. 6. ABSTRACT TEXT Approximately 500 words. 7. KEYWORDS List a maximum of five keywords. 8. BRIEF BIOGRAPHY (of principal author) Approximately 50 words. Conditions of Acceptance * Authors are expected to secure registration fees and travel and accommodation funding, through their sponsoring organizations before submitting abstracts. * Only original material should be submitted. * Commercial papers, descriptions of papers, with no research/development content, and papers where supporting data or a technical description cannot be given for proprietary reasons will not be accepted for presentation in this symposium. * Abstracts should contain enough detail to clearly convey the approach and the results of the research. * Government and company clearance to present and publish should be final at the time of submittal. * Applicants will be notified of acceptance by mail no later than 1 November 1999. Early notification of acceptance will be placed on the SPIE Web site the week of 27 September 1999 at: www.spie.org/info/ei/ Paper Review To ensure a high-quality conference, all abstracts and Proceedings of SPIE papers will be reviewed by the Conference Chairs for technical merit and content. Publishing Policy Manuscript due dates must be strictly observed. Whether the conference volume will be published before or after the meeting, late manuscripts run the risk of not being published in the Proceedings of SPIE. The objective of this policy is to better serve the conference participants and the technical community at large. Your cooperation is appreciated by all. Final Summary Accepted authors will receive instructions for submission of the 200-word Final Summary in their author kit. The Final Summaries will be published and available at the meeting. Oral or Poster Presentation Accepted authors will receive instructions for Oral and Poster presentations in their author kit. All Oral and Poster presentations are included in the Proceedings of SPIE and require a manuscript. Proceedings of SPIE These conferences will result in volumes published in the Proceedings of SPIE that can be ordered through the Advance Technical Program. Camera-ready manuscripts are required of all accepted applicants and must be submitted in English by 27 December 1999. Copyright to the manuscript is expected to be released for publication in the Proceedings of SPIE. Note: If an author does not attend the meeting and make a presentation, the chair may choose not to publish the author's manuscript in the conference volume. Papers published are indexed in leading scientific databases including INSPEC, Compendex Plus, Physics Abstracts, Chemical Abstracts, International Aerospace Abstracts, and Index to Scientific and Technical Proceedings. Participant Registration Fee Authors and coauthors are accorded a reduced symposium registration fee.