Signal Processing for 3D Imaging and Virtual Reality
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Special Issue of EURASIP Journal on Applied Signal Processing
In the last years we have witnessed major advances on image
display technologies and computer graphics hardware. Also the
development of new three dimensional (3D) sensors and new
technologies to acquire 3D information has opened new research
fields. This has made possible real-time, realistic and
interactive visualization of complex 3D data, and immersive
virtual environments. This would not be made possible without
significant progress to signal processing, image processing,
computer vision and computer graphics. Transforming, conditioning,
modeling and feature extraction of multivariate signals are some
of the most active areas of signal-processing applied to 3D
imaging applications.
The purpose of this special issue is to bring together leading
signal processing technologies devoted to 3D imaging and virtual
reality (VR) applications. This will help to build a better
understanding of the potentialities of this field of research in a
world that will be more than ever dominated by realistic 3D
imaging of information. Prospective papers should be unpublished
and present solid research works offering innovative contributions
either from a methodological or application point of view.
Topics of interest include (but are not limited to):
- 3D acquisition techniques
- 3D reconstruction, surface approximation & multiresolution modelling
- Virtual Environments for scientific visualisation of complex
multivariate data
- 3D sound imaging
- Multi-modal HCI for Virtual Environments
- Image based rendering
- Virtual reality in medicine
- 3D data coding and communication in Collaborative Virtual Environments
- 3D data fusion and registration
- Haptic VR interfaces and motion tracking
- Representation / Animation of Body and Face models
- Modeling from multiple views and image sequences
- 3D model based video representations
Authors should follow the EURASIP JASP manuscript format described
at the Journal site http://asp.hindawi.com/. Prospective authors
should submit an electronic copy of their complete manuscript
through the EURASIP JASPís web submission system at
http://asp.hindawi.com/, according to the following timetable.
Manuscript Due August 31, 2001
Acceptance Notification February 28, 2002
Final Manuscript Due April 15, 2002
Publication Date 2nd Quarter, 2002
GUEST EDITORS:
Dr. Michael G. Strintzis, Director Informatics & Telematics
Institute, Center of Research and Technology Hellas, Department of
Electrical & Computer Engineering, Aristotle University of
Thessaloniki, 54006 Thessaloniki, Greece; strintzi@eng.auth.gr
Dr. Ferran Marques, Technical University of Catalonia (UPC),
Campus Nord, Modul D5, C/ Jordi Girona 1-3, 08034 Barcelona Spain;
ferran@gps.tsc.upc.es
Prof. Fabio Lavagetto, University of Genova, Via Opera Pia 13,
Genova, Italy; fabio@dist.unige.it
EDITORIAL BOARD REPRESENTATIVE:
Prof. Kiyoharu Aizawa, University of Tokyo, Japan