3DIM2007: 6th International Conference on 3-D Digital Imaging and Modeling *August 21-23, 2007* Omni Mont-Royal Hotel Montréal, Québec, Canada http://www.3DIMconference.org IMPORTANT DATES: Full paper submission: *April 2, 2007* Notification of results: May 9, 2007 Final paper due: May 31, 2007 PROGRAM CO-CHAIRS: Patrick Hébert, Laval University (Canada) Takeshi Masuda, AIST (Japan) Gabriel Taubin, Brown University (USA) CONFERENCE CHAIR: Guy Godin, National Research Council (Canada) SCOPE: The 3DIM Conference was launched in 1997 as a forum for researchers from academic, industrial and national laboratories in the fields of computer vision, computer graphics, photogrammetry and geometric modeling, as well as for end users in application areas. Contributions to the five previous 3DIM Conferences have reflected the theoretical developments, technological innovations, and applications arising in 3D imaging, modeling and visualization. While some research issues have received significant attention and matured into stable solutions, new problems and goals are emerging as the focus of the 3-D research community. The 10th anniversary of the 3DIM Conference is the occasion to evaluate the progress accomplished, identify challenges that lie ahead and share innovative approaches. The 3DIM 2007 Conference Committee invites you to submit high quality original full papers by April 2, 2007. The papers will be reviewed by an international Program Committee. Accepted papers will be presented in single-track oral sessions as well as extended poster sessions (all papers are allocated the same number of pages). As with previous 3DIM conferences, the Conference Proceedings will be published by the IEEE Computer Society Press and archived in their Digital Library. Full details on the paper format, electronic submission procedure and conference venue are available on the conference website. Papers are invited in the areas of: - Smart/enhanced/hand-held sensors - Sensor calibration methods - Sensor performance assessment - Automated view planning - 3-D from multiple images and video - Camera positioning - Geometric signal processing - Shape-from-X techniques - Image registration and integration - Multi-resolution 3-D representations - Shape and appearance modeling - Deformable models - Object recognition and classification - Surface/solid modeling from images - Reverse engineering - Dimensional inspection - Object/human/environment models - Manufacturing/medical applications - Cultural/archaeological applications - 3-D visualization and interfaces - Modeling for virtual reality as well as related areas. This year, we are particularly seeking papers on the themes of: - appearance modeling of 3D surfaces from observation, combined or not with geometric modeling; - deformable models, including modeling of deformable objects as well as mathematical/computational optimization approaches for surface evolution; - high speed and real-time systems for capturing the 3D shape of deformable and/or moving objects. FOR MORE INFORMATION: http://www.3DIMconference.org