Hot3D'2011 extended submission deadlines (more details below) : - Regular Paper (up to 6 pages): extended to March 7, 2011 - Position Paper (up to 2 pages): ASAP, up to May 15, 2011 2011 International Workshop on Hot Topics in 3D Multimedia - Hot3D http://hot3d.org Friday, July 15, 2011 Barcelona, Spain (in conjunction with ICME ’2011) Call for Papers The 3D research community is at a potentially revolutionary point. From one side, 3D display technology is at the verge of becoming widespread and reasonably priced, and that includes autostereoscopic displays. From another direction, increases in computational power – including powerful GPUs – has allowed an ever-increasing realism in 3D scene generation. 3D audio is now often tightly integrated with 3D environments, including 5.1 (and higher) and even 3D soundfield reproduction. Haptic systems are also being tightly integrated within 3D systems. Quality evaluation of 3D systems itself is of great importance, and is also showing fast progress. Finally, new depth cameras, coupled with new 3D analysis and synthesis algorithms are close to enable commercial-quality 3D rendering of real scenes, instead of being restricted to synthetic scenes as in the past. All these factors together create the “perfect storm”: an environment prone for an explosion of related technology and applications, with a speed of development that will not fit in the (slower) cycle of traditional conferences and journals. In other words, while appropriate venues for presenting research at advanced stages is plentiful, the 3D Multimedia community lacks an appropriate venue for receiving feedback during early or initial stages of the development of radical or potentially disruptive technology. This is exactly the void that Hot3D tries to fill, providing an environment for lively discussion of early-stage, potentially disruptive research. Papers in all areas of 3D Multimedia are solicited. Early stage or preliminary results from potentially disruptive technology is particularly encouraged. Full papers (up to 6 pages) will be published in the ICME proceedings. Additionally, and maybe most importantly, position papers are solicited for short presentation and discussion of preliminary work or ideas. Submit a proposal of up to 2 pages, with a decision expected up to 4 weeks after submission. The 1-day workshop will be held on Friday, July 15, and is co-located with ICME 2011, the flagship multimedia conference sponsored by four IEEE societies. The workshop will be a unique opportunity to interact with other researchers working on 3D Multimedia. With an environment designed to facilitate discussion and feedback in early stage research, as well as forge new collaboration, this is an event not to be missed. Submit Regular Paper (up to 6 pages) by: extended to March 7, 2011 Notification of Regular Paper Acceptance: April 10, 2011 Camera-Ready Paper Due: April 20, 2011 Position Paper (up to 2 pages) Submission: ASAP, up to May 15, 2011 Notification of Position Paper Acceptance: approximately 4 weeks after submission For details about the workshop and a link to the submission system, please point your WWW browser to the workshop homepage at http://hot3d.org Organizing Committee: Touradj Ebrahimi, EPFL Lausanne, Switzerland; Aljoscha Smolic, Disney Research, Zurich, Switzerland; Eckehard Steinbach, Technische Universität München, Germany Steering Committee: Dinei Florencio, Microsoft Research, USA; Murat Tekalp, Koc University, Turkey; Anthony Vetro, Mitsubishi, USA; Cha Zhang, Microsoft Research, USA Program Committee: Ghassan Alregib, Georgia Tech, USA; Marc Antonini, I3S-CNRS-University of Nice Sophia Antipolis, France; John Apostolopoulos, Hewlett-Packard Laboratories, USA; Homer Chen, NTU, Taiwan; Gene Cheung, National Institute of Informatics, Japan; Philip A. Chou, Microsoft Reserach, USA; Minh Do, University of Ilinois, USA; Abdulmotaleb El Saddik, University of Ottawa, Canada; Peter Eisert, Heinrich-Hertz-Institute, Germany; Dinei Florencio, Microsoft Research, USA; Yo-Sung Ho, Gwangju Institute of Science and Technology, Korea; Ebroul Izquierdo, Queen Mary, University of London, UK; Marcus Magnor, TU Braunschweig, Germany; Enrico Masala, Polytecnico di Turino, Italy; Antonio Ortega, University of Southern California, USA; Marius Preda, Institut TELECOM, France; Murat Tekalp, Koc University, Turkey; Anthony Vetro, Mitsubishi Electric Research Laboratories, USA; Cha Zhang, Microsoft Research, USA; Zhengyou Zhang, Microsoft Research, USA; Mårten Sjöström, Mid Sweden University, Sweden; Atanas Gotchev, TU Tampere, Finland; Thomas Sikora, TU Berlin, Germany; Francisco Morán Burgos, Universidad Politécnica de Madrid, Spain; Marc Pollefeys, ETH Zurich, Switzerland; Margrit Gelautz, TU Vienna, Austria; Aydin Alatan, Middle East Technical University, Turkey; Alexis Tourapis, Dolby, USA; Frederic Dufaux, ParisTECH, France; Lina Karam, Arizona State University, USA; Peter Schelkens, Vrije Universiteit Brussel, Belgium; Karsten Müller, HHI, Germany