***************************************************** CALL FOR PAPERS 11th IEEE IVMSP Workshop: 3D Image/Video Technologies and Applications (IVMSP 2013) June 10 – 12, 2013 Yonsei University, Seoul, South Korea Sponsored by IEEE Signal Processing Society http://www.ivmsp2013.org/ ***************************************************** Papers submission deadline: February 10, 2013. (http://www.ivmsp2013.org/cpaper/) Original, high quality papers are solicited for the 2013 IEEE Image, Video and Multidimensional Signal Processing Technical Committee (IVMSP 2013) Workshop on “3D Image/Video Technologies and Applications”, to be held on June 10 - 12 at the Yonsei University, Seoul, South Korea. The goal of the workshop is to bring together researchers and engineers working on 3D image/video processing and analysis as well as emerging technical applications over 3DTV, 3D devices and 3D display technologies. The objective of this workshop is to trigger initiatives and deep insights on 3D core technologies in academia and industry. ***Topics: (http://www.ivmsp2013.org/cpaper/) Topics include, but are not limited to: 3D Visualization, 3D Capture and Processing, 3D Coding and Transmission, 3D User Interfaces, 3DTV Content Analysis, Description and Search, 3D/multichannel Audio Processing and Analysis, 3D Computer/robotic Vision, 3D Computer Graphics, 3D Cultural Object Analysis and Visualization, 3D Geographic Visualization, 3D Quality of Experience, Depth Data Analysis, Multiview Video Analysis, Registration of 3D Data from Various Modalities, Robotic Navigation, Scientific Visualization, Virtual Reality Applications, Other related topics. ***Submission of Papers (http://www.ivmsp2013.org/authors/) Submission of papers for IVMSP 2013 is now open. Papers submission deadline: February 10, 2013 *** Important Dates: Submission Deadline for Special Sessions Proposals: Nov. 1, 2012 Notification of Special Sessions Proposals: Nov. 15, 2012 Submission of Full papers: Feb. 10, 2013 Notification of Acceptance: Mar. 26, 2013 Author’s Registration Deadline: Apr. 10, 2013 Submission of Accepted Camera-Ready Papers: Apr. 26, 2013 Advance Registration and Resort Reservation Deadline: May 3, 2013 ***Workshop Venue and Hotel: (http://www.ivmsp2013.org/participants/venue.html) IVMSP 2013 will be held at the Yonsei University, located in Seodaemun-gu, Seoul, South Korea. There are two hotels near the Yonsei University. The two hotels will provide a special rate for IVMSP 2013 participants. ***Organizing Committee: (http://www.ivmsp2013.org/committee/) General Chair Sanghoon Lee, Yonsei University, Korea General Co-chair Ioannis Pitas, Aristotle University of Thesaloniki, Greece Technical Program Chair Nikos Nikolaidis, Aristotle University of Thesaloniki, Greece Technical Program Co-chair Truong Nguyen, Univ of California, San Diego, U.S.A. Honorary Co-chair ChangYeong Kim, Samsung Electronics, Korea Advisory Board Alan C. Bovik, University of Texas at Austin, U.S.A. C.-C. Jay Kuo, University of Southern California, U.S.A. Touradj Ebrahimi, EPFL, Switzerland James E. Fowler, Mississippi State University, U.S.A. Local Arrangements Chairs Jong-Moon Chung, Yonsei University, Korea Dong-Gyu Sim, Kwangwoon University, Korea Jong-Seok Lee, Yonsei University, Korea Special Session Co-chairs James Do Kyoon Kim, Samsung Electronics, Korea Shang-Hong Lai, National Tsing Hua University, Taiwan Masayuki Tanimoto, Nagoya Industrial Science Research Institute, Japan Publicity Chairs Xiangyang Ji, Tsinghua University, China Damon Chandler, Oklahoma State University, U.S.A. Publications Chair Kwanghoon Sohn, Yonsei University, Korea Registration Chair Changick Kim, Korea Advanced Institute of Science and Technology, Korea Finance Chair Nam Kim, Chungbuk National University, Korea Liaisons Oliver Grau for Europe, BBC, United Kingdom Dae Won Yoon for Asia, Korea Agency for Technology & Standards, Korea Sangmi Choi for Korea Industry, Korea Electronics-Association, Korea Minh N Do for North America, University of Illinois at Urbana-Champaign, North America Kiyoharu Aizawa for Japan, University of Tokyo, Japan Wen Gao for China, Peking University, China