************************************************************************* CALL FOR PARTICIPATION 11th IEEE IVMSP Workshop: 3D Image/Video Technologies and Applications (IVMSP 2013) June 10 – 12, 2013 Yonsei University, Seoul, South Korea Sponsored by IEEE Signal Processing Society (http://www.ivmsp2013.org/) ************************************************************************* Advance Registration deadline: May 31, 2013. (http://www.ivmsp2013.org/dates/) The 2013 IEEE IVMSP Workshop “3D Image/Video Technologies and Applications” of the IEEE Signal Processing Society, will be held on June 10 – 1, 2013 at the Yonsei University, Seoul, South Korea. The goal of the workshop is to bring together researchers and engineers working on 3D image/video processing and analysis as well as emerging technical applications over 3DTV, 3D devices and 3D display technologies. The objective of this workshop is to trigger initiatives and deep insights on 3D core technologies in academia and industry. ***Topics: Regular Sessions: (http://www.ivmsp2013.org/programs/regular.html) 3D Acquisition and Display Hardware, 3D Processing and Analysis, Depth Estimation, Analysis & Processing, 3D Perceptual Quality. Special Sessions: (http://www.ivmsp2013.org/programs/special.html) 3D depth map estimation and processing, Quality of experience of 3D multimedia, 3D Reconstruction Systems and Applications, Video Compression and Its Applications for 3D contents, Intelligent analysis and description of 3DTV Content, 3D Content Generation and Communication, 3D reconstruction and immersive environments, 3D tele-immersive presence with depth camera. ***Workshop Tutorial on 3DTV Content Analysis and Description (http://www.ivmsp2013.org/programs/) Workshop Tutorial 1. Ioannis Pitas (Aristotle University of Thessaloniki) Topic: 3DTV Content Analysis Methods Workshop Tutorial 2. Nikos Nikolaidis (Aristotle University of Thessaloniki) Topic: 3DTV Content Description Schemes ***Keynote Speakers (http://www.ivmsp2013.org/keynote/) Keynote Speaker 1. Martin S. Banks (University of California at Berkeley) Topic: The Limits of Human Stereo in Space and Time Keynote Speaker 2. Alan Conrad Bovik (The University of Texas at Austin) Topic: Perspectives on Natural 3D Statistics Keynote Speaker 3. Marc Pollefeys (Swiss Federal Institute of Technology Zurich) Topic: 3D from Images Keynote Speaker 4. Jong-Mo Seo (Seoul National University College) Topic: Dynamic vs. Static Vision and Stereopsis ***Advance Registration: (http://www.ivmsp2013.org/registration/) Advance Registration and Resort Reservation Deadline: May 31, 2013 ***Workshop Venue and Hotel: (http://www.ivmsp2013.org/participants/venue.html) IVMSP 2013 will be held at the Yonsei University, located in Seodaemun-gu, Seoul, South Korea. There are two hotels near Yonsei University. The two hotels will provide a special rate for IVMSP 2013 participants. ***Organizing Committee: (http://www.ivmsp2013.org/committee/) General Chair Sanghoon Lee, Yonsei University, Korea General Co-chair Ioannis Pitas, Aristotle University of Thesaloniki, Greece Technical Program Chair Nikos Nikolaidis, Aristotle University of Thesaloniki, Greece Technical Program Co-chair Truong Nguyen, Univ of California, San Diego, U.S.A. Honorary Co-chair ChangYeong Kim, Samsung Electronics, Korea Advisory Board Alan C. Bovik, University of Texas at Austin, U.S.A. Dae-Gwon Jeong, The Korean Society of Broadcast Engineers, Korea C.-C. Jay Kuo, University of Southern California, U.S.A. Ho-Jin Lee, ETRI, Korea Touradj Ebrahimi, EPFL, Switzerland James E. Fowler, Mississippi State University, U.S.A. Dong Won Han, ETRI, Korea Local Arrangements Chairs Jong-Moon Chung, Yonsei University, Korea Dong-Gyu Sim, Kwangwoon University, Korea Jong-Seok Lee, Yonsei University, Korea Seonjoo Kim, Yonsei University, Korea Special Session Co-chairs James Do Kyoon Kim, Samsung Electronics, Korea Ping An, Shanghai University, China Shang-Hong Lai, National Tsing Hua University, Taiwan Masayuki Tanimoto, Nagoya Industrial Science Research Institute, Japan Publicity Chairs Xiangyang Ji, Tsinghua University, China Damon Chandler, Oklahoma State University, U.S.A. Publications Chair Kwanghoon Sohn, Yonsei University, Korea Registration Chair Changick Kim, Korea Advanced Institute of Science and Technology, Korea Chia-Wen Lin, National Tsing Hua University, Taiwan Finance Chair Nam Kim, Chungbuk National University, Korea Exhibition Chair Yo-Sung Ho, Gwangju Institute of Science and Technology, Korea Industrial Chair Chieteuk Ahn, ETRI and Yonsei University, Korea Liaisons Oliver Grau for Europe, BBC, United Kingdom Dae Won Yoon for Asia, Korea Agency for Technology & Standards, Korea Sangmi Choi for Korea Industry, Korea Electronics-Association, Korea Minh N Do for North America, University of Illinois at Urbana-Champaign, North America Kiyoharu Aizawa for Japan, University of Tokyo, Japan Wen Gao for China, Peking University, China