CFP: 3DV (3D Vision) December 8-11, 2014, Tokyo We invite submissions for the 3DV (3D Vision) conference to be held December 8-11, 2014 in Tokyo, JAPAN. This meeting will be a continuation of the successful 3DIM and 3DPVT conference series. Submissions are solicited on topics related to acquiring, modeling, analyzing, and visualizing 3D data. The event will provide a premier forum for disseminating ideas and results that cover a broad scope of topics related to 3D research in computer vision and graphics, from novel optical sensors, signal processing, geometric modeling, representation, and transmission, to visualization and interaction, and a variety of applications. The organizers invite you to submit high quality, original full research papers by July 9, 2014. Topics of interest include, but are not limited to: ACQUISITION & MODELING - 3D cameras and sensors - Real-time 3D systems - Automated view planning - 3D sensor calibration - Image-based modeling - Shape-from-X - Shape and appearance modeling - 4D capture INTERACTION & VISUALIZATION - Image and video-based rendering - Interactive modeling - Augmented and mixed reality - 3D printing and rapid prototyping - Psychophysics of 3D sensing PROCESSING & TRANSMISSION - Geometric signal processing - Multi-resolution 3D representations - 3D shape retrieval and recognition - Shape analysis and morphology - 3D compression and transmission APPLICATIONS - Reverse engineering - Dimensional inspection & metrology - Cultural heritage & architecture - Medical visualization and analysis - Urban modeling - Robotics - 3D television - 3D tele-immersion - Forensics and security General Chair Katsushi Ikeuchi, The University of Tokyo Program Chairs Martial Hebert, Carnegie Mellon University Hiroshi Kawasaki, Kagoshima University Lourdes Agapito, University College London Important Dates Paper submission: July 9, 2014 Paper notification: August 31, 2014 Paper camera ready: September 19, 2014 Conference: December 8-11, 2014 On the Web: http://www.3dv.org http://www.3dv.org/data/3dv2014-flyer.pdf Contact Information: Email:3dv2014contact@ml.sys.wakayama-u.ac.jp